IBM Telum (microprocessor)
| General information | |
|---|---|
| Launched | 2021 |
| Designed by | IBM |
| Performance | |
| Max. CPU clock rate | >5 GHz |
| Cache | |
| L2 cache | 32 MB per core |
| Architecture and classification | |
| Technology node | 7 nm |
| Instruction set | z/Architecture |
| Physical specifications | |
| Cores |
|
| History | |
| Predecessor | z15 |
The Telum is a microprocessor made by IBM for their IBM Z mainframe computers, announced at the Hot Chips 2021 conference on August 23, 2021. Telum is IBM's first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place.[1] A Telum-based system is planned for the first half of 2022.[2][3][4]
Description
The chip contains 8 processor cores with a deep superscalar out-of-order pipeline, running with more than 5 GHz clock frequency, optimized for the demands of heterogenous enterprise class workloads. The completely redesigned cache and chip-interconnection infrastructure provides 32 MB cache per core, and can scale to 32 Telum chips. The dual-chip module design contains 22 billion transistors and 19 miles of wire on 17 metal layers.
See also
References
- ^ Combs, Veronica (2021-08-24). "IBM's new Telum Processor is the company's first with an on-chip AI accelerator". TechRepublic. Retrieved 2021-08-27.
- ^ "IBM Unveils On-Chip Accelerated Artificial Intelligence Processor" (Press release). IBM. August 23, 2021.
- ^ "IBM Telum Processor: the next-gen microprocessor for IBM Z and IBM LinuxONE". IBM. August 23, 2021.
- ^ "New Approaches For Processor Architectures". Semiconductor Engineering. August 23, 2021.